Our international client is now searching for a Semiconductor Packaging Engineer to be responsible for co-ordinating multi site projects to develop and release novel new packaged devices. The role will involve interfacing with assembly centres around the globe as well as carrying out mechanical and thermal modelling of products.
Required skills for the successful Packaging Engineer will include the following:
-Strong semiconductor packaging background
-Ansys modelling software knowledge beneficial
-Knowledge of the semiconductor manufacturing environment
-Excellent communication skills
-BSc in Physics / Electrical Engineering or equivalent
Please call us to discuss further.
A number of the following key skills are required for the role: IC, semiconductor, packaging, modelling, engineer, device, Ansys, fab, thermal, manufacturing, jobs