Package Design Engineer - France
Our international client now requires a Package Design Engineer to be in charge of designing packaging solutions for high performance IC sensor products. Driving package development for BGA, PGA, CLCC and WLCSP packages will be required as well as interacting with packaging manufacturers and subcontractors. Working closely with project teams will be a critical part of the role and conducting package design reviews.
Required skills include;
-Good knowledge of IC semiconductor packaging
-Package design tool experience (Cadence APD)
- Experience of working within a high volume semiconductor manufacturing environment
-Ability to work with various departments within the company
-French language experience desirable
-BSC Degree or equivalent qualifications
Please call us to discuss further.
A number of the following key skills will be required for the role: IC, semiconductor, packaging, engineer, QFN, WLCSP, BGA, Cadence, APD, subcontractor, France, manufacturing, jobs