Package Development Engineer - East Anglia
Our international client now requires a Package Development Engineer to lead the design of semiconductor packages. Identifying package requirements and interfacing with subcontractors will be part of the role as well as defining packaging roadmaps and strategic plans for future packages. Packages will include QFN, WLCSP and BGA.
Required skills include;
-Good knowledge of IC semiconductor packaging
-Package design tool experience (Cadence APD, Virtuoso, Autocad)
- Experience of working within a high volume semiconductor manufacturing environment
-Ability to work with various departments within the company
-Far Eastern subcontractor experience desirable
-BSC Degree or equivalent qualifications
Please call us to discuss further.
A number of the following key skills will be required for the role: IC, semiconductor, packaging, engineer, QFN, WLCSP, BGA, Cadence, APD, subcontractor, manufacturing, jobs