Principal Process Assembly Engineer - Midlands
Our client is now looking for a Principal Assembly Process Engineer to be responsible for process development activities and new product introductions of packaged components. The role will involve building prototypes and demonstrating product feasibility as well as being involved with pilot line transfer to full scale manufacturing facilities.
Required skills include;
-Strong semiconductor assembly and process experience
-Die bonding and wire bonding experience
-Optoelectronic device knowledge
-Excellent communication skills
-BSc Degree in Electrical Engineering/Physics or related discipline
Please call us to discuss further.
A number of the following key skills are required: IC, semiconductor, assembly, optoelectronic, senior, engineer, die bond, wire bond, NPI, transfer, device, manufacturing, jobs