A new and exciting opportunity has now arisen with our client located in Ireland who are searching for an IC Packaging Engineer to lead the development of advanced packaging solutions (MMIC and MCM). The role will involve driving package design and material selection as well as working with external subcontractors.
Required skills for the Senior Packaging Engineer will include;
-Strong semiconductor advanced IC packaging knowledge
-MMIC / MCM knowledge
-Experience with assembly processes - wirebond / flipchip etc
-Excellent communication skills
-BSc Degree qualified physics, electronics or equivalent
Please call us to discuss further.
A number of the following key skills will be required for the role: Semiconductor, IC, packaging, engineer, MMIC, MCM, wirebond, flipchip, assembly, fab, manufacturing and jobs