{"id":145977,"date":"2026-06-12T00:00:00","date_gmt":"2026-06-11T23:00:00","guid":{"rendered":"https:\/\/ic-resources.com\/jobs\/senior-npi-packaging-engineer-472625\/"},"modified":"2026-07-24T18:06:02","modified_gmt":"2026-07-24T17:06:02","slug":"senior-npi-packaging-engineer-472625","status":"publish","type":"jobs","link":"https:\/\/ic-resources.com\/de\/jobs\/senior-npi-packaging-engineer-472625\/","title":{"rendered":"Senior NPI Packaging Engineer"},"content":{"rendered":"<p><span style=\"font-family: Verdana;font-size: 14px\">Our international client is currently searching for a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from package concept and technology selection through design, validation, qualification, and manufacturing handover. Working closely with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions will be required.<\/span><\/p>\n<p><span style=\"font-family: Verdana;font-size: 14px\"><strong>Key Responsibilities<\/strong><\/span><\/p>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN\/QFN, BGA, SiP, WLCSP).<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Evaluate packaging technologies and drive supplier\/manufacturing partner development.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Improve packaging design processes, tools, and methodologies for efficient NPI delivery.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Analyze assembly data and communicate technical findings.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Maintain awareness of industry and academic developments in semiconductor packaging.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-family: Verdana;font-size: 14px\"><strong>Requirements<\/strong><\/span><\/p>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Master\u2019s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">~6 years\u2019 experience in semiconductor packaging\/NPI development.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong knowledge of semiconductor assembly processes and package technologies.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Experience with supplier design rules and 3D CAD tools (e.g., AutoCAD).<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Understanding of package thermal characterization.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Ability to work with global cross-functional teams and external partners.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong ownership, communication, and technical presentation skills.<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Fluent English communication skills.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-family: Verdana;font-size: 14px\"><strong>Preferred Experience<\/strong><\/span><\/p>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">3D multiphysics simulation tools (Cadence, ANSYS, or equivalent).<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Package reliability\/qualification testing (MSL, TC, HAST, HTS, JEDEC standards).<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Structured problem-solving methods (8D, DOE).<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Package layout tools such as Cadence Allegro X APD and Klayout.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-family: Verdana;font-size: 14px\">Please contact Rachel Anderson for further details.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Our international client is currently searching for a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from package concept and technology selection through design, validation, qualification, and manufacturing handover. Working closely with global internal teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging [&hellip;]<\/p>\n","protected":false},"featured_media":0,"template":"","team-industry":[],"job_sector":[699],"job_expertise":[682],"job_skillset":[795],"consultants":[250],"industry":[],"class_list":["post-145977","jobs","type-jobs","status-publish","hentry","consultants-rachel-anderson"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v26.6 (Yoast SEO v27.8) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Senior NPI Packaging Engineer - Remote<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ic-resources.com\/de\/jobs\/senior-npi-packaging-engineer-472625\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Senior NPI Packaging Engineer - Remote\" \/>\n<meta property=\"og:description\" content=\"Apply to Senior NPI Packaging Engineer - UK, Remote. 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