{"id":181783,"date":"2026-07-21T00:00:00","date_gmt":"2026-07-20T23:00:00","guid":{"rendered":"https:\/\/ic-resources.com\/jobs\/lead-application-engineer-490577\/"},"modified":"2026-07-24T14:06:34","modified_gmt":"2026-07-24T13:06:34","slug":"lead-application-engineer-490577","status":"publish","type":"jobs","link":"https:\/\/ic-resources.com\/de\/jobs\/lead-application-engineer-490577\/","title":{"rendered":"Lead Application Engineer"},"content":{"rendered":"

Lead Application Engineer \u2013 Physical Design \/ Digital Implementation (ASIC, SoC)<\/strong><\/span><\/h1>\n

A global leader in Electronic Design Automation (EDA)<\/strong> is looking for a Lead Application Engineer<\/strong> to support leading semiconductor companies developing next-generation ASIC and SoC<\/strong> designs. This opportunity is ideal for an experienced Physical Design Engineer, Digital Implementation Engineer, ASIC Backend Engineer, Signoff Engineer, STA Engineer or Physical Implementation Engineer<\/strong> looking to combine deep technical expertise with customer-facing work.<\/span><\/p>\n

Working with advanced digital implementation, timing closure, power analysis, EM\/IR signoff and low-power ASIC design<\/strong>, you’ll help customers achieve industry-leading Power, Performance and Area (PPA)<\/strong> while influencing the development of next-generation AI-enabled semiconductor design technology.<\/span><\/p>\n

The role<\/span><\/h3>\n

You’ll work closely with semiconductor customers to solve complex ASIC backend, physical design and signoff<\/strong> challenges, leading technical evaluations, proof-of-concepts and customer workshops. You’ll also collaborate with R&D teams to influence future EDA tools and methodologies for advanced-node silicon development.<\/span><\/p>\n

Requirements<\/span><\/h3>\n
    \n
  • Degree in Electronic Engineering, Electrical Engineering or Microelectronics<\/span><\/li>\n
  • 5+ years‘ experience in Physical Design, Digital Implementation, ASIC Backend, Place & Route (PnR), Physical Implementation or Signoff Engineering<\/strong><\/span><\/li>\n
  • Strong experience with Power Analysis, EM\/IR Signoff, Timing Closure or Static Timing Analysis (STA)<\/strong><\/span><\/li>\n
  • Knowledge of advanced-node ASIC design<\/strong>, low-power design<\/strong>, UPF\/CPF<\/strong>, and modern semiconductor implementation flows<\/span><\/li>\n
  • Excellent communication skills and fluent English<\/span><\/li>\n<\/ul>\n

    Desirable experience<\/span><\/h3>\n
      \n
    • Experience with Innovus, Tempus, Voltus, Joules or similar EDA tools<\/span><\/li>\n
    • Customer-facing engineering, Field Application Engineering or technical consulting experience<\/span><\/li>\n
    • Exposure to AI-assisted chip design and advanced semiconductor workflows<\/span><\/li>\n<\/ul>\n

      Why join?<\/span><\/h3>\n
        \n
      • Work with some of the world’s leading semiconductor and AI companies<\/span><\/li>\n
      • Solve complex ASIC, SoC, Physical Design and Digital Implementation challenges at advanced process nodes<\/span><\/li>\n
      • Influence the future of EDA tools through close collaboration with world-class R&D teams<\/span><\/li>\n
      • Join a collaborative engineering team offering excellent technical development and long-term career progression<\/span><\/li>\n<\/ul>\n

        For more information, please contact Steph Hutchinson.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

        Lead Application Engineer \u2013 Physical Design \/ Digital Implementation (ASIC, SoC) A global leader in Electronic Design Automation (EDA) is looking for a Lead Application Engineer to support leading semiconductor companies developing next-generation ASIC and SoC designs. This opportunity is ideal for an experienced Physical Design Engineer, Digital Implementation Engineer, ASIC Backend Engineer, Signoff Engineer, […]<\/p>\n","protected":false},"featured_media":0,"template":"","team-industry":[],"job_sector":[699],"job_expertise":[709],"job_skillset":[718],"consultants":[801],"industry":[],"class_list":["post-181783","jobs","type-jobs","status-publish","hentry","consultants-steph-hutchinson"],"acf":[],"yoast_head":"\nLead Application Engineer - Germany<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ic-resources.com\/de\/jobs\/lead-application-engineer-490577\/\" \/>\n<meta property=\"og:locale\" content=\"de_DE\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Lead Application Engineer - Germany\" \/>\n<meta property=\"og:description\" content=\"Apply to Lead Application Engineer - Bavaria, Germany. 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