{"id":236528,"date":"2026-09-30T00:00:00","date_gmt":"2026-09-29T23:00:00","guid":{"rendered":"https:\/\/ic-resources.com\/jobs\/director-of-semiconductor-packaging-522779\/"},"modified":"2026-10-17T10:13:09","modified_gmt":"2026-10-17T09:13:09","slug":"director-of-semiconductor-packaging-522779","status":"publish","type":"jobs","link":"https:\/\/ic-resources.com\/de\/jobs\/director-of-semiconductor-packaging-522779\/","title":{"rendered":"Director of Semiconductor Packaging"},"content":{"rendered":"<p><span style=\"font-family: Verdana;font-size: 14px\">A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.<\/span><\/p>\n<p><span style=\"font-family: Verdana;font-size: 14px\">The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging\/manufacturing partners.<\/span><\/p>\n<h2><span style=\"font-family: Verdana;font-size: 14px\">Key Responsibilities<\/span><\/h2>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Lead the design and development of high-performance, high-density semiconductor packages for GaN power products<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Balance electrical, thermal, mechanical, cost, quality and form-factor requirements<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Lead packaging development with overseas assembly houses and technology suppliers<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Support package verification, qualification, reliability and thermal testing<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Conduct first-article inspection and failure analysis<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Provide packaging expertise to Applications Engineering and customers<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Contribute significantly to the product and technology roadmap<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Build external networks and maintain awareness of state-of-the-art semiconductor packaging<\/span><\/li>\n<\/ul>\n<h2><span style=\"font-family: Verdana;font-size: 14px\">Essential Experience &amp; Skills<\/span><\/h2>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Degree or higher in Engineering, Physics, Materials Science or a related discipline<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Deep knowledge of packaging technologies including:<\/span>\n<ul>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Die attach \/ Ag-sintering<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Flip-chip<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Wire bonding<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Copper clip<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">PCB embedding<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Chip metallisation<\/span><\/li>\n<\/ul>\n<\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong 3D CAD experience and knowledge of supplier design rules\/DFM<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong 3D multiphysics\/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Experience with thermal characterisation of semiconductor packages<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Experience with package qualification\/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Strong cross-functional leadership and supplier-management skills<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Ability to manage priorities independently and deliver results<\/span><\/li>\n<li><span style=\"font-family: Verdana;font-size: 14px\">Confident presenting technical results to internal and external stakeholders<\/span><\/li>\n<\/ul>\n<p><span style=\"font-family: Verdana;font-size: 14px\">Please contact Rachel Anderson for further details.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors. The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams [&hellip;]<\/p>\n","protected":false},"featured_media":0,"template":"","team-industry":[],"job_sector":[699],"job_expertise":[682],"job_skillset":[795],"consultants":[250],"industry":[],"class_list":["post-236528","jobs","type-jobs","status-publish","hentry","consultants-rachel-anderson"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v28.6 (Yoast SEO v28.6) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Director of Semiconductor Packaging - England<\/title>\n<meta name=\"description\" content=\"Apply to Director of Semiconductor Packaging - Cambridgeshire, England. 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