IC Packaging Design and Simulation Engineer

Our international client is currently searching for an IC packaging, Design and Simulation Engineer to be responsible for new package design and design simulation. The role will involve modelling and analyzing new substrate designs as well as optimizing mechanical and thermal requirements. Solving and enhancing PI (power integrity) and SI (signal integrity) designs will be required. This role can be based in multiple locations including the UK, Switzerland, Taiwan and Germany.

Required skills for the IC Packaging Engineer will include:

• Semiconductor IC package design experience
• Signal integrity /power integrity knowledge
• Experience with high volume semiconductor manufacturing
• Strong communication skills
• Degree in Electrical Engineering and/or Materials Science and/or Mechanical Engineering is preferred

Please contact Rachel Anderson for further details.