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IC Packaging Engineer

Remote, UK

Contract

Rate dependant on experience

V-179649

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IC Resources is working with a client based in Oxford who are seeking an IC Packaging engineer to join their team as soon as possible. 
  • Contract length 2months 
  • Outside IR35
  • Remote working option available
Experience needed:
  • 2.5D / 3D Custom Packaging solutions
  • High speed RF Analog Photonics interconnect
  • ESD
  • Wire bonding
  • Transmission line modelling.
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