Our award winning start-up is currently searching for a Senior PIC Packaging Engineer to lead and coordinate packaging efforts within the business. The role will involve working with foundries on various packaging projects and coordinating and leading teams. Working with silicon, indium phosphide, silicon nitride materials will be an important part of the role.
Required skills for the PIC Packaging Expert will include:
- Strong fabrication and packaging experience within a semiconductor environment
- Experience with flip chip and wirebond assembly processes
- Capability of leading teams and managing projects with excellent communication skills.
- PhD in photonics, engineering, or physics beneficial.
Please contact Rachel Anderson for further details.
