Advanced Packaging Engineer

Our innovative new star-up with recent industry funding is now searching for an Advanced Packaging Engineer to drive the device packaging projects and road-maps for the company. The role will involve developing 2.5/3D advanced packaging solutions and liaising with OSAT's for the cycle of concept-explore, design, DFM, engineering runs, development and quality/reliability. Managing the internal packaging team will be a key part of the role as well as driving overall package development within the company. This role can worked from a remote location.

Required skills for the Advanced Packaging Engineer will include:

• Strong semiconductor packaging experience and knowledge
• 2.5/3D advanced packaging solutions knowledge
• Excellent communication and ability to manage teams
• Previous experience with liasing with OSAT's
• Degree qualified

Please contact Rachel Anderson for further details.