Advanced Packaging Engineer

Our Grenoble based client is currently searching for an Advanced Packaging Engineer to join silicon photonic chip packaging team. The role will involve designing advanced packaging solutions for silicon photonic ICs and taking them from design to mass production. Identifying and managing subcontractors will be an important part of the role, as well as interaction with customers to ensure product requirements are met.

Required skills for the Advanced Packaging Engineer will include:

• Strong advanced semiconductor packaging knowledge
• Micro-optical or fibre optic assembly process experience
• Semiconductor assembly processes such as flip-chip and wire-bond manufacturing flow
• Strong communication skills
• PhD, engineering school or master's degree Physics, Electrical Engineering, or Electronics Engineering 

Please contact Rachel Anderson for further details.