Lead Field Application Engineer APAC

Lead Field Application Engineer APAC – Product designed with Swiss’s innovation.

Providing chip-to-chip link, built with quality and precision engineering from Switzerland, an industry leader is looking for professional to join their team in Taiwan and leading the APAC FAE activities.

Your role as the Lead Field Application Engineer APAC will be managing the FAE APAC team and your major duties are as shown below:

• Allocate of staff to projects
• Report project status to the management.
• Mentor junior FAE team to support customer base in the region.
• Defining staff member’s goals and responsible for time off requests.
• Coaching, performance review, and development of the staff

Required Experience

• Experience as Lead Field Application Engineer
• Solid understanding of key-signal integrity challenges/solutions for high-speed SerDes, ability to run SI simulations is a plus Protocol knowledge (USB, PCIe, Ethernet)
• Some knowledge of advanced packaging, high-speed SerDes test equipment, CPU, GPU, DSP, Ethernet Switch/Packet Processor ASIC architectures
• Familiarity with Schematic Capture and PCB layout EDA tools, Logic Analysers, and high-speed test equipment
• Solid understanding of applications for high speed SerDes in networking and consumer environments including: Ethernet, PCIe, USB, etc.
• Demonstrated team leadership in a fast pace customer interfacing role

 

Salary ranges from USD$ 100K+ depends on ability.     

Please feel free to contact Simpson at IC Resources if you are interested in this Lead Field Application Engineer APAC and other opportunities.