Principal PA Design Engineer

Boston, Massachusetts


$170,000 - $200,000 Base DOE + Bonus and Stock!


Are you an experienced PA Design Engineer with a passion for developing cutting-edge RF power amplifiers? Join a leading technology company in Andover, Massachusetts, known for its innovation in wireless front-end module products. We are seeking a Principal PA Design Engineer to join their multinational organisation.

Why Andover, Massachusetts?

Andover offers a unique blend of small-town charm and proximity to major urban amenities. With excellent schools, beautiful parks, and a vibrant community, it's an ideal place for both personal and professional growth. Enjoy the rich history, diverse dining options, and easy access to Boston's cultural and educational opportunities.

Key Responsibilities as a Principal PA Design Engineer
  • Develop RF power amplifiers using GaAs or GaN HBT technologies and co-package with other ICs.
  • Collaborate with project engineers and cross-functional teams for seamless product development.
  • Conduct linear and nonlinear simulations to ensure optimal performance.
  • Perform feasibility analysis and simulations for new product developments.
  • Lead die-level floor planning and design/simulate fully integrated power amplifier ICs considering package effects.
  • Manage design trade-offs on performance, risk, yield, testability, and cost.
  • Support hardware validations, analyse measurement data, and enhance performance.
  • Develop and present technical reviews and presentations to internal teams.
Qualifications as a Principal PA Design Engineer

Technical Expertise:
  • Familiarity with amplifier modes (Class A, AB, B, C, F, F-1).
  • In-depth knowledge of PA bias circuit designs.
  • Extensive RFIC/PA design experience using GaAs and/or GaN.
  • Expertise in on-chip ESD protection strategies.
  • Experience with Keysight ADS, Cadence, and related simulation engines.
  • Knowledge of 2.5D (EMX, Momentum, Sonnet) and 3-D (HFSS, FEM) EM design simulation tools.
  • Understanding of laminate, wire bonding, WLCSP techniques, SMT components, and multi-die FEM considerations.
  • Experience with thermal design considerations for RF front-end modules.
  • Strong lab skills for characterisation, optimisation, and debugging.
  • Ability to execute project tasks with minimal supervision.
  • Excellent oral and written communication skills.

This is an excellent opportunity for a motivated Principal PA Design Engineer to make a significant impact within a dynamic and innovative company. If you are passionate about RF technology and meet the qualifications, we encourage you to apply.

Interested in the position? Please feel free to apply or contact Zac Taylor.
Apply now