Principal Power Semiconductor Packaging Engineer
Graz, Austria,
Paris, Île-de-France,
Berlin, Germany,
South Holland, Rotterdam, Netherlands
Permanent
Leading international salary + benefits
V-200217
Rachel Anderson
Semiconductor Process | Test
Our global client is currently searching for a Principal Power Semiconductor Packaging Engineer to join the dynamic and experienced team.
The successful candidate will work within the Operations organisation while collaborating with other business functions including R&D, Quality & Reliability and Sales & Marketing, to lead the product transition into high volume manufacturing. Developing power products will be part of the role as well as the maintenance of design and process development documentation.
Travel to subcontractors will be necessary, and the role can be based world-wide.
Required skills for the Principal Power Semiconductor Packaging Engineer will include:
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The successful candidate will work within the Operations organisation while collaborating with other business functions including R&D, Quality & Reliability and Sales & Marketing, to lead the product transition into high volume manufacturing. Developing power products will be part of the role as well as the maintenance of design and process development documentation.
Travel to subcontractors will be necessary, and the role can be based world-wide.
Required skills for the Principal Power Semiconductor Packaging Engineer will include:
- Strong power semiconductor packaging development background
- Deep understanding of high power density discrete and modules
- Proficiency in 3D modeling software, such as SolidWorks, Fusion360 or similar
- Strong communication skills
- Bachelor's Degree in Electronic, Mechanical, Industrialisation Engineering or Material Science
