Senior Packaging Engineer
Oxfordshire, England
Permanent
Leading industry salary + benefits
V-196827
Rachel Anderson
Semiconductor Process | Test
Our cutting edge client is currently searching for a Packaging Engineer to join the photonics operations team. The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture.
Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.
Required skills for the Packaging Engineer will include:
Apply now
Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.
Required skills for the Packaging Engineer will include:
- Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc
- Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
- Photonics packaging experience desirable
- Strong communication skills
- Master’s degree in a relevant technical field
Related roles
Search all our jobsSemiconductor Process Architect
Suffolk, England
Permanent
Rolling 1 year contract + benefits
Read more
MOCVD Growth Engineer
Singapore, Asia Pac
Permanent
Industry Leading Salary
Read more
Semiconductor Process Technician
County Durham, England
Permanent
Leading industry salary + benefits
Read more