Our international client is currently searching for an Assembly Process Engineer to be responsible for developing and implementing programs and applications on chip integration systems. The role will involve material characterization and analysis to solve customer problems. Material characterization, test methods and analysis will also be required, as well as working on the assembly bonding process.
Required skills for the Assembly Process Engineer will include:
- Semiconductor assembly / packaging knowledge and experience
- Failure analysis / material process knowledge
- Strong communication skills
- BS degree in Engineering or equivalent
Please contact Rachel Anderson for further details.