Our innovative and exciting new client is currently searching for an IC Packaging Expert to lead the development of new advanced packages for the company. The role will involve developing and advising on new package development, as well as incorporating the testing of the new packages and devices. Reporting to senior management and leading company critical projects will be key.
Requires skills for the IC Packaging Expert will include:
- Strong semiconductor packaging knowledge
- Multi chip advanced packaging experience
- Photonics and package test knowledge beneficial
- Strong communication and project leadership skills
- Degree qualified
Please contact Rachel Anderson for further details.