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Principal Engineer - Passive Components, Remote


Principal Engineer - Passive Components, United Kingdom


Job ID: 175730-1
Location: Remote, UK
Salary: Competitive salary + Bonus, Pension & additional benefits
Job Type: Permanent


As a Principal Engineer for Passive Component Integration, you will be part of the Technology Pre-Development group and be the lead expert on passive components, including their construction and integration within semiconductor packaging in order to generate a solution that is fit for purpose within our customers' applications.

Responsibilities include:
  • Be the subject matter expert on passive components who has an in-depth understanding of construction, scope of use, and subsequently reliability and failure modes of the passive components during use.
  • Be the technical lead working with passive suppliers, assembly subcontractors, and internal assembly factories along with the internal application teams to determine best fit component type selection and integration scheme for target applications and packaging technologies.
  • Determine the strategic direction on passive technologies for integration.
  • Generate and maintain a passives integration roadmap for technologies and any developments required.
  • Select passive components for product development based on application requirements, considering design concept, cost requirements, quality and reliability.
  • Drive risk assessments and propose preventive/corrective actions relating to passive component integration to improve product quality and product manufacturing stability.
  • Collaborate with OSATs to address identified risks and translate results into control plans for the passive components as part of the overall Safe Launch Planning.
  • Approve the release of passive components selected for product and field use.
Experience & Requirements:
  • A Master degree in a Science, Engineering, or Materials discipline.
  • At least 10 years of experience with passive components, preferably in design /construction, manufacture, quality, reliability, and failure modes.
  • Experience with interactions between passive components and typical semiconductor materials, such as mold compounds and laminates, is an advantage.
  • Experience with new platforms development and working with DFMEA, PFMEA, DOE, risk assessments, and stage gated development process. 


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