APPLY FOR

Process Engineer - Wafer Thinning/Polishing, Devon


Process Engineer - Wafer Thinning/Polishing, Devon


Job ID: 162948
Location: Devon, England, UK
Salary: Leading Edge Salary
Job Type: Permanent
This job is no longer live. See below for related jobs, or start a new search


Our leading edge client is currently searching for Process Engineer to work within the silicon wafer processing field of backgrind and dicing. The successful candidate will have knowledge and experience of wafer thinning, surface polishing, dicing, wafer re-sizing and edge re-profiling. The successful candidate will have good knowledge of metrology equipment required to keep these processes in control.

The Process Engineer job responsibilities will include:
  • Recipe development and optimisation at the Fab tool level.
  • Process tool ownership, including responsibility for documentation, training and tool performance monitoring.
  • Integration of tool recipes into the Process architecture.
  • Reporting progress to management at weekly and monthly intervals.
  • Specifying new tools, chemicals and techniques as required to meet the business objectives.
Requirements for the Process Engineer
  • At least 5 years’ experience working in the Semiconductor process Industry
  • Wafer thinning / polishing experience desirable
  • A wish for a long-term career with us here in the beautiful South West
  • BSc degree or equivalent Physic, Electronics, Engineering
Please contact Rachel Anderson for further details.

 

 


REQUEST A CALL
OR CALL US ON
+44 (0)118 988 1150

Book a call