Our international client is currently searching for a Semiconductor Packaging Applications Engineer to be responsible for package design and analysis of EDA tools. The role will involve researching best practice package design methodologies for key customers and to analyse package designs with regards to signal and power integrity. Training key customers on advanced packages will be required as well as optimising designs for electrical performance. You will be part of a global packaging team and the role can be based anywhere in Europe/UK with occasional travel.
Required skills for the Semiconductor Packaging Application Engineer will include:
- Strong IC package design experience (Cadence Allegro, APD or SiP tools)
- Signal and power integrity experience
- Strong English language skills
- Degree in micro-electronics/physics or equivalent
Please contact Rachel Anderson for further details.