Our client now requires a Semiconductor Packaging Engineer to be responsible for new package development and implementing package design flows. Performing design, layout and signal integrity will be required as well as EM modelling of IC, package and PCB using Cadence Allegro tools.
Required skills will include;
- Strong IC semiconductor packaging experience
- Experience of using Cadence Allegro design tools
- Signal integrity knowledge
- Excellent communication skills
- Degree in Physics / Engineering or equivalent
Please contact Rachel Anderson for more information.
