Our international client is currently searching for a Semiconductor Assembly Packaging Engineer to provide package design and development for new semiconductor products. The role will involve being responsible for the thermal/mechanical/electrical design, analysis, and development of assembly packages. Establishing material specifications for contract assemblers will be required as well as interfacing with Product Engineering and Quality Assurance departments.
Required skills for the Assembly Packaging Engineer will include:
- Semiconductor assembly and packaging experience within a manufacturing environment
- Thermal/mechanical and electrical package design knowledge
- Strong communication skills
- Degree in Engineering, Science or Mathematics required, or equivalent education, training and experience
Please contact Rachel Anderson for further details.