Our client is currently searching for a Semiconductor Packaging Engineer to be responsible for the new packaging concept generation. The role will involve developing and leading packaging activities within the company and working with various technology departments.
Required experience for the Packaging Engineer will be as follows,
- Strong semiconductor advanced packaging knowledge
- Semiconductor manufacturing experience
- Wire-bonding / flip chip knowledge
- Excellent communication skills
- Engineering Degree in Electronic Engineering / Physics or equivalent
Please contact Rachel Anderson to discuss further.
