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Field Application Engineer – Semiconductor Packaging

Field Application Engineer required for an IC Packaging company based in France who are looking for individuals with experience within semiconductor test, qualification and/or assembly.

Suitable candidates will have knowledge of IC Packaging, such as chip-scale package or multi-chip modules. Experience within RF or mixed signal IC devices would also be required.

You would be expected to travel as and when required, and would typically be around 40% of your time.

Field Application Engineer Requirements:

* Degree qualified within Electronics, Electrical Engineering, Computer Science or related subject.

* Experience within semiconductor test, qualification and/or assembly

* Understanding of the automotive, RF, high speed communications and/or IoT markets would be preferable

* Flexible with a willingness to travel within France and across Europe

* Languages - Fluent in English, other languages such as French or German is advantageous

For more information please do not hesitate to get in touch.


Dave Sharman

+44 1189 077881


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