Our client is currently searching for the Head of Advanced Packaging to lead the semiconductor packaging team. The role will involve developing and leading packaging activities within the company and growing the team. Working with the business development team to drive projects and support bid writing will also be part of the role.
Required experience for the Advanced Packaging Head will be as follows,
- Strong semiconductor advanced packaging knowledge
- Semiconductor manufacturing experience
- Team leadership and project management experience
- Engineering Degree / PhD in Electronic Engineering / Physics or equivalent
Please call Rachel to discuss further.
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