Our client is currently searching for a Semiconductor Packaging Engineer to be responsible for the development and production of high performance IR camera sensors. The role will involve developing new packages for new products as well as validating packages and test. Working with subcontractors and production engineering teams will be required.
Required experience for the Packaging Engineer will be as follows,
-Semiconductor IC packaging engineering experience
-Wafer process knowledge
-Reliability experience beneficial
-Excellent communication skills
-Engineering Degree / PhD in Electronic Engineering / Physics or equivalent
Please call to discuss further
You can search for a new job here.