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Semiconductor Packaging Engineer

Our client is now searching for a Semiconductor Packaging Engineer to be responsible for the R&D and engineering support for the packaging of new IC products. The role will involve new package design and material selection as well as subcontractor technical management. A certain amount of reliability test planning and failure analysis will also be required.

Required skills for the Senior IC Packaging Engineer include;

- Strong semiconductor packaging experience (flipchip / BGA)

- 3D packaging knowledge

- Semiconductor reliability knowledge

- Excellent communication skills

- BSc Degree in Electrical Engineering/Physics or related discipline

Please contact Rachel at IC Resources to discuss further.

South West England

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