Our client is now searching for a Semiconductor Packaging Engineer to be responsible for the R&D and engineering support for the packaging of new IC products. The role will involve new package design and material selection as well as subcontractor technical management. A certain amount of reliability test planning and failure analysis will also be required.
Required skills for the Senior IC Packaging Engineer include;
- Strong semiconductor packaging experience (flipchip / BGA)
- 3D packaging knowledge
- Semiconductor reliability knowledge
- Excellent communication skills
- BSc Degree in Electrical Engineering/Physics or related discipline
Please contact Rachel at IC Resources to discuss further.
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