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Semiconductor Packaging Engineer

Our Munich based client is currently searching for a Semiconductor Packaging Engineer to be responsible for working with customers on advanced IC package development programs and helping to co-design chips and packages to optimise performance. The role will involve proposing best practice package design methodologies as well as analysing new package designs.


Requirements for the Packaging Engineer will include:

  • Strong semiconductor packaging knowledge (advanced packages)
  • Cadence Allegro, APD or SiP Layout tool experience beneficial
  • Excellent communication skills
  • MSc/BSc degree in Electronics/Physics or equivalent


Please contact Rachel.Anderson@ic-resources.com for further details.


Baden-Wurttemberg, Bavaria, Rhineland-Palatinate, Saarland

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Job Details
  • Munich, Germany
  • Permanent
  • JO-1904-138566_icr
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