Shift Semiconductor Process Engineer

Northamptonshire, England
Leading salary plus shift premium
Job ID: 534122
Rachel Anderson
Rachel Anderson

Semiconductor Process | Test

+44 (0)208 400 2480

rachel.anderson@ic-resources.com

Our international client is currently searching for a Shift Semiconductor Process Engineer to provide hands-on, shift-based engineering support across semiconductor fabrication and backend manufacturing, ensuring safe, stable and efficient production. Working a rotating 12-hour shift pattern (2 days, 2 nights, 4 days off), the role focuses on process control, troubleshooting, yield improvement, production recovery and new product introduction (NPI).

Technology areas may include lithography and e-beam lithography, dry and wet etching, thin-film and metal deposition, and backend wafer processing.

Key Responsibilities

  • Provide technical support to Manufacturing, troubleshooting process, product and equipment issues.

  • Monitor process performance using SPC, MES and manufacturing data systems, responding to abnormal conditions.

  • Investigate process excursions, identify root causes and implement containment, corrective and recovery actions.

  • Improve yield, quality, process capability, throughput, cycle time and cost.

  • Support process development, qualification, optimisation and NPI.

  • Apply SPC, DOE, Six Sigma, Lean and statistical methods to drive continuous improvement.

  • Escalate recurring or significant issues to relevant engineering teams and process owners.

  • Mentor Manufacturing personnel and ensure compliance with process controls, quality standards and health, safety and environmental requirements.

Education, Skills & Experience

  • Degree, postgraduate qualification or equivalent industrial experience in Semiconductor Technology, Materials Science, Physics, Chemistry, Engineering or a related discipline.

  • Experience in semiconductor, MEMS, silicon photonics or other advanced manufacturing environments.

  • Practical knowledge of one or more semiconductor processes, including lithography, etching, deposition, metallisation or backend wafer processing.

  • Backend experience in wafer mounting, thinning, back grinding, CMP, polishing, cleaving or dicing is highly desirable.

  • Understanding of SPC, DOE, Six Sigma, Lean Manufacturing and root-cause analysis.

  • Strong analytical, troubleshooting and problem-solving skills, with the ability to interpret process and equipment data.

  • Ability to work independently under pressure and collaborate effectively across multidisciplinary teams.

  • Good written and verbal communication skills, including technical documentation and knowledge sharing.

Please contact Rachel Anderson for further details.