Director of Semiconductor Packaging

A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.

The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.

Key Responsibilities

• Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes
• Balance electrical, thermal, mechanical, cost, quality and form-factor requirements
• Lead packaging development with overseas assembly houses and technology suppliers
• Support package verification, qualification, reliability and thermal testing
• Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs
• Conduct first-article inspection and failure analysis
• Provide packaging expertise to Applications Engineering and customers
• Contribute significantly to the product and technology roadmap
• Build external networks and maintain awareness of state-of-the-art semiconductor packaging

Essential Experience & Skills

• Degree or higher in Engineering, Physics, Materials Science or a related discipline
• Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses
• Deep knowledge of packaging technologies including:
  • Die attach / Ag-sintering
  • Flip-chip
  • Wire bonding
  • Copper clip
  • PCB embedding
  • Chip metallisation
• Strong 3D CAD experience and knowledge of supplier design rules/DFM
• Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
• Experience with thermal characterisation of semiconductor packages
• Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
• Strong cross-functional leadership and supplier-management skills
• Ability to manage priorities independently and deliver results
• Confident presenting technical results to internal and external stakeholders

Please contact Rachel Anderson for further details.