Lead Application Engineer

Bavaria, Germany
Base between €80,000-€95,000 dependent on experience
Job ID: 481720
Jordan Browne
Jordan Browne

ASIC | Verification | Physical Design

+44 (0)118 907 3075

jordan.browne@ic-resources.com

Our client, a global leader in semiconductor EDA technology, is looking to hire a Senior Application Engineer to support some of the industry’s most advanced chip design companies across Europe.

This Senior Application Engineer position is ideal for someone with a strong background in Physical Design, Digital Implementation or Signoff who enjoys combining technical expertise with customer interaction. You’ll work closely with engineering teams to help optimise advanced ASIC designs, while influencing future product development through direct collaboration with R&D.

As a Senior Application Engineer, you’ll provide technical guidance throughout the implementation and signoff flow, supporting customer evaluations, solving complex design challenges and helping engineers achieve the best possible power, performance and area (PPA) results. The role also offers the opportunity to work with the latest AI-driven design technologies as they become increasingly integrated into modern digital design flows.

Key Responsibilities

  • Support customers with advanced Digital Implementation and Signoff challenges across leading-edge semiconductor designs
  • Deliver technical demonstrations, workshops and design reviews, helping customers maximise the value of the tool flow
  • Lead proof-of-concept activities and benchmark projects while providing practical solutions to complex implementation issues
  • Work alongside sales teams during technical engagements, acting as the subject matter expert throughout the evaluation process
  • Collaborate closely with product development teams, providing customer feedback that helps shape future tool enhancements
  • Mentor less experienced engineers and contribute to technical knowledge sharing within the wider Applications Engineering organisation

Requirements

  • Industry experience within Physical Design, Digital Implementation, Signoff or a closely related ASIC design environment
  • Strong knowledge of Power Analysis together with EM/IR analysis or signoff methodologies
  • Experience with modern Digital Implementation flows and advanced process technologies
  • Confident communication skills with the ability to explain complex technical concepts to engineering teams and customers
  • Experience with industry-standard implementation and signoff tools would be beneficial, particularly across place & route, timing, power and power integrity analysis
  • Familiarity with low-power design methodologies and AI-assisted design technologies would be advantageous

This is an excellent opportunity to join our client’s Applications Engineering organisation, working with leading semiconductor companies on cutting-edge silicon projects while helping drive the adoption of next-generation Digital Implementation and Signoff technologies.

For more information on this role others then please contact Jordan Browne at IC Resources for more information.