Lead Application Engineer – Physical Design / Digital Implementation (ASIC, SoC)

A global leader in Electronic Design Automation (EDA) is looking for a Lead Application Engineer to support leading semiconductor companies developing next-generation ASIC and SoC designs. This opportunity is ideal for an experienced Physical Design Engineer, Digital Implementation Engineer, ASIC Backend Engineer, Signoff Engineer, STA Engineer or Physical Implementation Engineer looking to combine deep technical expertise with customer-facing work.

Working with advanced digital implementation, timing closure, power analysis, EM/IR signoff and low-power ASIC design, you’ll help customers achieve industry-leading Power, Performance and Area (PPA) while influencing the development of next-generation AI-enabled semiconductor design technology.

The role

You’ll work closely with semiconductor customers to solve complex ASIC backend, physical design and signoff challenges, leading technical evaluations, proof-of-concepts and customer workshops. You’ll also collaborate with R&D teams to influence future EDA tools and methodologies for advanced-node silicon development.

Requirements

• Degree in Electronic Engineering, Electrical Engineering or Microelectronics
• 5+ years‘ experience in Physical Design, Digital Implementation, ASIC Backend, Place & Route (PnR), Physical Implementation or Signoff Engineering
• Strong experience with Power Analysis, EM/IR Signoff, Timing Closure or Static Timing Analysis (STA)
• Knowledge of advanced-node ASIC design, low-power design, UPF/CPF, and modern semiconductor implementation flows
• Excellent communication skills and fluent English

Desirable experience

• Experience with Innovus, Tempus, Voltus, Joules or similar EDA tools
• Customer-facing engineering, Field Application Engineering or technical consulting experience
• Exposure to AI-assisted chip design and advanced semiconductor workflows

Why join?

• Work with some of the world’s leading semiconductor and AI companies
• Solve complex ASIC, SoC, Physical Design and Digital Implementation challenges at advanced process nodes
• Influence the future of EDA tools through close collaboration with world-class R&D teams
• Join a collaborative engineering team offering excellent technical development and long-term career progression

For more information, please contact Steph Hutchinson.