Advanced Packaging Engineer
South Holland, Netherlands
Exciting technologies with leadership opportunity!
Job ID: 401040
Ella Flynn
Optical Electronics
+44 118 436 3344
My client is looking for an Advanced Packaging Engineer to lead the 3D architecture for quantum applications, based in the Netherlands.
Job responsibilities:
- Lead R&D for entire cycle – with direct contribution to new packaging and assembly techniques
- Innovate and develop advanced packaging techniques
- Communicate and partner with external vendors and clients
You will have:
- Masters/PhD in Physics or related field
- Background in semiconductor packaging
- Experience with advanced packaging techniques
- Leadership background and comfortable communicating with stakeholders
Nice to have:
- Packaging tools knowledge e.g. thermal/mechanical techniques
- Background in hardware R&D
- Collaborative and excellent communication skills.
If you’re interested, contact Ella Flynn @ IC Resources.
1530 Arlington Business
Park, Berkshire.
RG7 4SA
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