ASIC | Verification
+44 (0)118 907 0378
Want to work on the digital architecture behind a new generation of high-bandwidth, low-power AI interconnect technology?
I’m working with an advanced semiconductor company developing chiplet-based connectivity and memory fabric technology for AI infrastructure, using a highly differentiated approach to moving data over copper.
They are now looking for an experienced Digital IC Design Engineer to work on very high-speed digital circuits and interfaces.
Ideally 5–10 years of digital IC / ASIC design experience, with strong knowledge of:
RTL Design | SystemVerilog / Verilog | ASIC Design | High-Speed Digital Design | SerDes | DDR | PCIe | USB4 | CDC | STA | Synthesis | Low-Power Design
Experience with multi-Gigabit transceivers, memory interfaces, mixed-signal ICs, Python scripting or Cadence tools would be particularly valuable.
This is not generic RTL implementation.
You’ll work at the boundary between digital design, mixed-signal circuits and high-speed communications, helping turn system-level ideas into production silicon.
The technology is aimed directly at one of the biggest problems in AI hardware today: moving huge amounts of data with less power, lower latency and better scalability.
Location: Lausanne, Switzerland
Experience: 5–10+ years
Education: MSc / PhD in Electronics, Electrical Engineering, Communications or equivalent experience
If your background is in high-speed digital design, SerDes, DDR, PCIe or communications ASICs, I’d be keen to speak with you contact Steph Hutchinson for more details.
1530 Arlington Business
Park, Berkshire.
RG7 4SA