My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
Responsibilities
- Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
- Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
- Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
- Define packaging technology roadmaps and drive long-term innovation
- Lead multidisciplinary technical projects across design, assembly, thermal and test
- Develop advanced microelectronic modules and system demonstrators
- Provide technical leadership across design, validation and qualification
- Support hands-on prototyping and laboratory development
- Contribute to technical proposals, bids and collaborative R&D programmes
- Manage technical risks and support technology decisions with customers and partners
Requirements
- Strong experience in advanced semiconductor packaging and heterogeneous integration
- Expertise in 2.5D/3D packaging, chiplets and advanced assembly
- Experience with substrates, interposers, TSVs and/or hybrid bonding
- Proven experience leading semiconductor packaging development projects
- Understanding of the full packaging lifecycle from design through qualification
- Knowledge of signal integrity, power integrity and thermal management
- Experience taking R&D concepts through to working prototypes or demonstrators
- Strong technical leadership, problem-solving and communication skills
- Experience in AI, HPC, telecoms or photonics is desired but not a must
Benefits
- Competitive salary + bonus
- Sponsorship + Relocation assistance
- Company pension
- Private healthcare for you and your family
- Hybrid working to fit around your schedule
- A healthy work environment, with great work life balance
If you are interested, contact Ella Flynn at IC Resources.