Photonics Packaging Engineer

My client is searching for a Photonics Packaging Engineer, to join their R&D team, based onsite in Pisa, Italy.

This is an excellent opportunity for an Engineer experienced in photonic and optoelectronic device packaging, to contribute to the development of next-generation photonic technologies.

Your responsibilities:

• Design and develop advanced photonic and optoelectronic devices, focusing on performance, manufacturability, and reliability
• Support micro-optical and fiber optic assembly
• Engage in assembly processes eg. die-attach, flip-chip and wire bonding
• Collaborate with engineers on integrated packaging solutions
• Support prototyping, testing, and process optimisation

You will have:

• Knowledge of photonic and semiconductor packaging 
• Hands-on experience with micro-optical or fibre optic assembly processes, eg. optical coupling
• Knowledge of semiconductor assembly flows eg. wire bonding
• Proficiency with CAD
• Masters degree in Physics, Electronics, or a related field

If you are looking to join a collaborative R&D environment developing cutting-edge photonic technologies, get in touch with Ella Flynn @ IC Resources.